The recent hack of Tata Electronics in India has leaked its complete Bill of Materials (BOM), exposing all domestic suppliers. Classified by component category, they are as follows:
I. Display Panels: BOE Technology Group Co., Ltd. (BOE A): A major domestic supplier of OLED screens for the standard iPhone 18, supplying panels for some mid-to-low-end models, and a core enterprise in Apple’s panel localization efforts.
II. Optical and Camera Modules: 1. Sunny Optical: A major supplier of front and rear camera modules and focusing motors, and a core assembler of the Pro series’ multi-camera setup; 2. Cowell Electronics: A supplier of 3D depth-sensing lenses and front camera modules; 3. Will Semiconductor (OmniVision): A secondary supplier of front image sensors, entering the iPhone 18 Pro’s front-facing camera supply chain.
III. Batteries and Power Components: 1. Desay Battery: A core manufacturer of battery packs for the entire iPhone series, and a major supplier of high-density batteries for the Pro series; 2. Sunwoda Electronic Co., Ltd.: A supplier of stacked lithium battery cells, handling orders for high-capacity models; 3. ATL: A source supplier of ultra-thin polymer cells. IV. Glass and Exterior Structural Components
1. Lens Technology: Exclusive main supplier of front and rear Ceramic Shield glass, camera protective cover, and UTG ultra-thin glass for foldable screens;
2. Changying Precision: Metal frame, titanium alloy structural components, foldable screen hinges;
3. BYD Electronics: Aluminum alloy body frame, internal support structure;
4. Lingyi Intelligent Manufacturing: Precision functional components, MagSafe magnetic components, heat dissipation pads, small metal mold components.
V. PCB Circuit Boards (Main Board/Flexible Board)
1. PENGDING HOLDING: SLP-type carrier boards, high-end HDI boards for motherboards, the largest domestic supplier of iPhone motherboards;
2. Dongshan Precision: FPC flexible circuit boards, antenna flexible boards;
3. Shennan Circuits: Auxiliary PCB supporting suppliers.
VI. Acoustic Components
1. Goertek: Full range of acoustic modules including speakers, microphones, and vibration motors;
2. AAC Technologies: High-end stereo speakers, miniature receivers. VII. Connectors, Wireless, and Assembly Manufacturing
1. Luxshare Precision: Type-C connectors, RF antennas, wireless charging modules; also an OEM for iPhones.
2. Foxconn Industrial Internet (FII): The world’s largest iPhone assembly plant; metal structural component processing.
3. Jingyan Technology: Foldable screen hinges, MIM metal powder injection molding parts.
VIII. Heat Dissipation and Auxiliary Materials
1. Zhongshi Technology, Anjie Technology: Graphite heat dissipation films, thermal conductive components.
2. Shunluo Electronics: RF passive components, inductors.
Additional Notes
1. The leaked documents directly disclose the unit price, annual order volume, and supply ratio of each model for various suppliers. This constitutes Apple’s top-secret business data, directly exposing the cost and market share distribution of the domestic supply chain.
2. Chip manufacturing (TSMC), high-end sensors (Sony), and high-end LTPO screens (Samsung/LG) are not domestic manufacturers and are not listed in the table above.
3. Following the leak, Apple has tightened access to data from its global factories, splitting the storage of component drawings. A complete list of domestic suppliers can no longer be accessed for a single factory.
